300W High Power LED Module Entertainment Stage Lighting with Small Emitting Area Chip Flip LED

Product Detail

Storage temperature(℃):-40 - 60Luminous color:natural white
port:ShenzhenPackaging Details:12pcs/tray Ultra Fast Heat Transfer Ceramic Base High Reliability Flip Chip LED Module 90W
application:High power LEDColor rendering index (Ra):70
LED chips:flip chipChip material:Ingen
type:COB LED, flip chip COB moduleStatic Sensitivity:±2,000V Human Body Model
Light attenuation (%):3current:5.5A
brand:Ge TianColor temperature:4000K~4500K /6000K-6500K,6000-6500K 8000-9000K
Supply capacity:80000 pieces per monthViewing angle(°):120
Origin:Guangdong, Chinalight intensity:70-80 lumens/watt
Forward Voltage:14-18Vpayment terms:T/T, Western Union
Junction temperature:115°CProcessing:Yes
Working temperature(℃):-40 - 60Thermal resistance:0.24℃/watt
strength:300WPower Consumption:300
Product Description

 

300W high power LED module stage entertainment lighting small emission area flip chip cob led

 

Features Flip Chip LED

flip-chip technology. No gold wire; high stability.
Low thermal resistance and faster heat dissipation
Small light emitting area, convenient for optical design
Wide power range of stage light series 60-300W

 

product name

Flip Chip COB Module

strengthCheck
angle
LESCCTVoltagecurrentLuminous flux
(GT-FC60)60W120°
flip chip
6.66*6.66mm6000-6500K
8000-9000K
14-18V3.75A5000-5500 lumens
(GT-FC90)90W6.66*6.66mm5.5A6000-6500 lumens
(GT-FC150)150W9.64*9.64mm21-24V6.7A11000-12000 lumens
(GT-FC300)300W13.48*13.48mm30-36V9.3A20000-22000 lumens
(GT-FC500)500W12.84*12.84mm30-36V15.5A30000-35000LM

 

Advantages of flip chip LED products:

 

1. No gold wire; led failure rate drops by 90%; high stability.

2. Ceramic Base: Realize the separation of heat conduction and conduction; high thermal conductivity; withstand high voltage above 3000V.

3. New chip technology: thermal resistance as low as 0.12°C/W.

4. Small luminous area: high luminous intensity; convenient for optical design with high central luminous flux.

5. High thermal conductivity alloy welding chip:Replace the old technology of epoxy soldering, not easy to fall off.

6. High thermal conductivity; low thermal resistance, a single chip can be driven to 1000mA, and the efficiency is higher.

7. Patented fluorescent powder technology: stable color temperature, no blooming.

8. Equipped with temperature sensor: more accurate heat dissipation and temperature control.

9. Simple installation design: easy to use.

10. Dust-proof design on the luminous surface: easy to keep the surface clean.

  

 

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