300W High Power LED Module Entertainment Stage Lighting with Small Emitting Area Chip Flip LED
- $15.55 / >=10 pieces
- 10 pieces
- Shenzhen Getian Opto-Electronics Co., Ltd.
- Guangdong, China
- Ms Jenny Liao
Product Detail
Storage temperature(℃): | -40 - 60 | Luminous color: | natural white |
port: | Shenzhen | Packaging Details: | 12pcs/tray Ultra Fast Heat Transfer Ceramic Base High Reliability Flip Chip LED Module 90W |
application: | High power LED | Color rendering index (Ra): | 70 |
LED chips: | flip chip | Chip material: | Ingen |
type: | COB LED, flip chip COB module | Static Sensitivity: | ±2,000V Human Body Model |
Light attenuation (%): | 3 | current: | 5.5A |
brand: | Ge Tian | Color temperature: | 4000K~4500K /6000K-6500K,6000-6500K 8000-9000K |
Supply capacity: | 80000 pieces per month | Viewing angle(°): | 120 |
Origin: | Guangdong, China | light intensity: | 70-80 lumens/watt |
Forward Voltage: | 14-18V | payment terms: | T/T, Western Union |
Junction temperature: | 115°C | Processing: | Yes |
Working temperature(℃): | -40 - 60 | Thermal resistance: | 0.24℃/watt |
strength: | 300W | Power Consumption: | 300 |
300W high power LED module stage entertainment lighting small emission area flip chip cob led
Features Flip Chip LED
flip-chip technology. No gold wire; high stability.
Low thermal resistance and faster heat dissipation
Small light emitting area, convenient for optical design
Wide power range of stage light series 60-300W
product name Flip Chip COB Module | strength | Check angle | LES | CCT | Voltage | current | Luminous flux |
(GT-FC60) | 60W | 120° flip chip | 6.66*6.66mm | 6000-6500K 8000-9000K | 14-18V | 3.75A | 5000-5500 lumens |
(GT-FC90) | 90W | 6.66*6.66mm | 5.5A | 6000-6500 lumens | |||
(GT-FC150) | 150W | 9.64*9.64mm | 21-24V | 6.7A | 11000-12000 lumens | ||
(GT-FC300) | 300W | 13.48*13.48mm | 30-36V | 9.3A | 20000-22000 lumens | ||
(GT-FC500) | 500W | 12.84*12.84mm | 30-36V | 15.5A | 30000-35000LM |
Advantages of flip chip LED products:
1. No gold wire; led failure rate drops by 90%; high stability.
2. Ceramic Base: Realize the separation of heat conduction and conduction; high thermal conductivity; withstand high voltage above 3000V.
3. New chip technology: thermal resistance as low as 0.12°C/W.
4. Small luminous area: high luminous intensity; convenient for optical design with high central luminous flux.
5. High thermal conductivity alloy welding chip:Replace the old technology of epoxy soldering, not easy to fall off.
6. High thermal conductivity; low thermal resistance, a single chip can be driven to 1000mA, and the efficiency is higher.
7. Patented fluorescent powder technology: stable color temperature, no blooming.
8. Equipped with temperature sensor: more accurate heat dissipation and temperature control.
9. Simple installation design: easy to use.
10. Dust-proof design on the luminous surface: easy to keep the surface clean.
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